Journal of microelectronics and electronic packaging rg. Home journal of microelectronics and electronic packaging october 2019 advanced search. Journal of microelectronics and electronic packaging read 348 articles with impact on researchgate, the professional network for scientists. Journals publications journal of electronic packaging. Reliability aspects are of extreme importance for assembly and packaging, which has become a limiting factor for both. Journal of dynamic systems, measurement, and control. Nanomicro joining technology and reliability of electronic packaging. All members of imaps will receive one copy of each issue of the printed magazine 6 times annually januaryfebruary, marchapril, mayjune, julyaugust, septemberoctober, and. Electronic packaging and semiconductor manufacturing are two major activities to produce microsystems including microelectronics, optoelectronics, microwaverf, biomedical devices, sensors, actuators, microscaled energy systems, etc. Citescore values are based on citation counts in a given year e.
The international microelectronics and packaging society is dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information, and the promotion of technologies. Experimental studies of electronics cooling capabilities. Home journal of microelectronics and electronic packaging january 2019. Advances in microelectronics packaging and interconnection. Abstract full text pdf 76 kb volume 16, issue 1 january 2019. Recent advances and trends in heterogeneous integrations.
Advanced materials microelectronics packaging materials. Rf and microwave microelectronics packaging springerlink. Sjr is a measure of scientific influence of journals that accounts for both the number of citations received by a journal and the importance or prestige of the journals where such citations. Journal of microelectronics and packaging society kci paper publication october tue15thu, 2015 kintex hall2, seoul llsan, korea. Metals and alloys used for the joining of vacuum electronic devices must be free. Journal of microelectronics, electronic components and materials vol. Electronic packaging and interconnection handbook 4e. Greater functional density packaged in a smaller form factor is the most persistent challenge facing the microelectronics research community. Journal of electronic packaging the group participants can visit this site and check for the latest papers published and free downloads of selected articles. Journal of microelectronics and electronic packaging.
Journal of microelectronics and electronic packaging 2015. Rf and microwave packages must meet the demand for very low thermal resistance and very low rf loss. Ramesham and others published journal of microelectronics and electronic packaging. He has authored over a dozen wellknown books in the field and is among the founders and past presidents of the international microelectronics and packaging society.
It is especially important to include papers published in 2015 2017 in the list. All submission must be in electronic format, preferably in pdf format, and. The international microelectronics assembly and packaging society imaps will host an advanced technical workshop in san diego on advanced packaging for medical microelectronics on january 2829, 2020, at the westgate hotel san diego, san diego, ca. Journal of microelectronics and electronic packaging issues. Journal of applied mechanics, journal of biomechanical engineering, journal of computing and information science in engineering, journal of dynamic systems, measurement and control, journal of electronic packaging, journal of energy resources technology, journal of engineering for gas turbines and power, journal of engineering materials and technology, journal of fluids engineering, journal of. The journal of microelectronics and electronic packaging, published by international. This manual wiring process was timeconsuming and error prone. International microelectronics and packaging society, 2004 microelectronics.
Electronic, optical and magnetic materials publisher. Advanced design and modeling software enables sti to design and develop highly integrated hardware to meet shrinking form and fit factor requirements as well as increasing thermal loads. Receive an update when the latest issues in this journal are published. Microelectronics packaging handbook pdf free download. Click here to get an email alert for every new issue of journal of microelectronics and electronic packaging. Integrated packaging, lowcost packaging, microelectronics, packaging. Journal of microelectronics and electronic packaging is published by international microelectronics and packaging society, which is located in the united states. Imaps microelectronics research portal journal table. Recent microelectronics reliability articles elsevier. The optomechanics and physical reliability lab focuses on using both optomechanics and finite element method to study the mechanical and reliability problems in electronic packaging materials, components, and products. The ieee electronics packaging society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Electronic packaging design is the skilful balancing and engineering of design tradeoffs at all levels of.
Microelectronics reliability vol 107, in progress april. Journal of microelectronics, electronic components and. Journal of microelectronics and electronic packaging rg journal impact. Packaging of compound semiconductor devices design signal integrity power integrity. Medical microelectronics international microelectronics. Joint crossroads for further progress and development. Hanyun jhang, mingxi ho, chohan lee, and fangshou lee 2019 experimental studies of electronics cooling capabilities at high altitude. Rf and microwave microelectronics packaging presents the latest developments in packaging for highfrequency electronics.
She is on the editorial board of the journal of microelectromechanical systems, journal of. Journal of computing and information science in engineering. Journal of microelectronics and electronic packaging rg journal. Advances in microelectronics packaging and interconnection technologies towards the new generation of hybrid microelectronics. In order to provide our readers with the most uptodate information and enhance journals impact, please include recent publications in your list of references. Journal of microelectronics and electronic packaging, volume 1, issues 24. Although early realisations of hybrid miniaturisation took advantage of the micro size of the ic microelectronics journal vo116 no 5 9 1985 benn electronics publications ltd, luton 31. Concurrently, to achieve higher circuit board component densities, package dimensions have been. Publications optomechanics and physical reliability lab. The journal is dedicated to advanced engineering methods for micro and nanofabrication of electronic devices, circuits and systems for electronics, electromechanics, and. Journal of electrochemical energy conversion and storage.
The journal of electronic packaging publishes papers that use experimental and theoretical analytical and computeraided methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. The aim of microelectronic engineering is to bring together in one publication the results of international work in the rapidly expanding field of integrated microelectronics. Rymaszewski published by van nostrand reinhold, 1989, 1194 pp. Modern ic packaging trends and their reliability implications. Issn 03529045 journal of microelectronics, electronic components and materials vol. Pdf an overview of advanced electronic packaging technology. This book includes information to help engineers improve their ability to verify. Aview of modern electronic packaging technology is presented along with its applications at apl.
Rf and microwave microelectronics packaging ii ken kuang. The journal of microelectronics and electronic packaging, published by international microelectronics assembly and packaging society imaps. The publication history of journal of microelectronics and electronic packaging covers 20052012, 2014ongoing. Imapsinternational microelectronics and packaging society. Journal of electronic packaging asme engineering network.
Materials research benefits microelectronics packaging, components, and radiation characterization. Editorial find, read and cite all the research you need on researchgate. Microelectronics failure analysis, desk reference, seventh edition offers the latest information on advanced failure analysis tools and techniques, illustrated with reallife examples. Eps publications advance theory and practice within the key technology areas of components, packaging and manufacturing technology. Papers published in the microelectronics journal have undergone peer. It will appeal to practicing engineers in the electronic packaging and highfrequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. Lau 2019 recent advances and trends in heterogeneous integrations. The microelectronics packaging lab was established to meet the rising need for advanced systems development and packaging to address the emerging challenges and issues facing todays electronics assemblies. Guide for authors microelectronic engineering issn. Journal of microelectronics and electronic packaging 2015 you are here. Electronic packaging interconnects chips and other components into a microsystem. Due to the breadth of work being performed in this field, this paper presents only a number of key packaging technologies. Needs assessment is divided into materials, packaging, components, and radiation characterization.
Published since 1969, the microelectronics journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. For authors journal of microelectronics and electronic packaging. The key electronic technologies responsible for the growth of the industry include semiconductors. Hermetic lids are necessary for semiconductor mems, medical or optical applications to shield devices from moisture.
Thermal stress and strain in microelectronics packaging. Materion offers a wide variety of standard designs or products customized to your specifications. Microelectronics journal vol 25, issue 1, pages 178. Identifying the development state of sintered silver ag as a bonding material in the microelectronic packaging via a patent landscape study asme j. Ken kuang is president of torrey hills technologies, llc, a leader in the supply of quality microelectronics packaging components. Mechanical reliability in electronic packaging mechanical reliability in electronic packaging amagai, masazumi 20020401 00. Technologies for high performance systems, intel technology journal, 2005.
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